Exhibition Info

DesignCon 2025 Santa Clara USA

DesignCon 2025 Santa Clara USA
America's largest chip, board, and systems event
Date:  29 - 30 January 2025
Venue:  Santa Clara Convention Center, Santa Clara, USA


DesignCon is the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.

DesignCon is the country’s largest gathering of chip, board, and systems designers. For more than 25 years, design engineers and other industry professionals come together in Silicon Valley to search for techniques and products to handle the latest signal and power integrity challenges. These potential buyers are the reason why 90% of 2020’s exhibitors reported a positive return on their show investment. Book your booth space now.

The health, well-being, and safety of our visitors is always DesignCon’s top priority. That’s why we’re actively working to ensure a successful event that includes a safe environment in line with official public health guidance and a move to the spacious San Jose McEnery Convention Center, the first convention center in Northern California to receive the Global Biorisk Advisory Council (GBAC) STAR outbreak prevention, response, and recovery accreditation. For your convenience, we will be regularly updating our FAQ page with information on how we are planning a productive and safe in-person event.

As the rate of technical innovation continues to increase, so will the need for practical insights and solutions. Immerse yourself in the expertly curated DesignCon conference curriculum, created by engineers for engineers. With 100+ sessions spanning 14 tracks, DesignCon 2025's conference program covers all aspects of electronic design, including signal & power integrity, high-speed link design, and machine learning.

From foundational to applicational, topics and areas of coverage include:

  • Signal and power integrity
  • Chip I/O and power modeling
  • Photonics and wireless in electrical design
  • Materials and processing for PCBs, modules, and packages
  • Advanced I/O interface design
  • High-speed link design
  • Signal processing, equalization, and coding/FEC
  • Power integrity in power distribution networks
  • Electromagnetic compatibility and interference
  • Test and measurement methodology
  • Interconnects modeling and analysis
  • Machine learning and AI
  • 5G and communications
Number of visit : 5,551

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